Upper Loading

ARD_X_VRPM_B

Versal Premium
(Upper Loading)

The ARD_X_VRPM_B is a scalable power supply designed to provide power to AMD Versal Premium Upper Loading FPGA devices. The designs is scalable to support the cost- and power-optimized FPGA devices.

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Design recommended by AMD

UPPER LOADING

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POWER TREE MAPPING – UPPER LOADING

#	Rail	Seq	Power Component	Type	Upstream Rail	Vinput (V)	Vout (V)	Iout (A)	AnDAPT PMIC
1	VCCO_HDIO (VCCO_HDIO, VCCO_500, VCCO_501, VCCO_502, VCCO_503)	1	C200	Integ. Sync Buck	PVIN	12	1.8	0.1-3	ARD_X_VRPM_B_IC1
2	VCCO_XPIO	1	C200	Integ. Sync Buck	PVIN	12	1.5	0.1-3	ARD_X_VRPM_B_IC1
3	VCCINT (VCCINT, VCC_PMC, VCC_PSFP, VCC_PSLP, VCC_CPM5, VCC_RAM, VCC_GT, VCC_SOC, VCC_IO)	2	Ext.	Ext.	PVIN	12	0.8 / 0.88	80 – 180	ARD_X_VRPM_B_IC1
4	VCCAUX (VCCAUX, VCCAUX_PMC, VCCAUX_SMON)	2	C220	Integ. Sync Buck	PVIN	12	1.5	1.5 – 10	ARD_X_VRPM_B_IC1
5	MGTYAVCC (MGTYAVCC, GTAVCC)	3	C865	1-ph DrMOS Ctrl	PVIN	12	0.88 / 0.92	6 – 15	ARD_X_VRPM_B_IC2
6	MGTYAVCCAUX (MGTYAVCCAUX, GTAVCCAUX)	4	C200	Integ. Sync Buck	PVIN	12	1.5	1	ARD_X_VRPM_B_IC2
7	MGTYAVTT (MGTYAVTT, GTAVTT)	5	C860	1-ph DrMOS Ctrl	PVIN	12	1.2	8 – 24	ARD_X_VRPM_B_IC2

ANDAPT SOLUTION – UPPER LOADING

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THERMAL VIEW IC1

DESIGN VIEW IC2

THERMAL VIEW IC2

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